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Ultra-precise polishing technology - List of Manufacturers, Suppliers, Companies and Products

Ultra-precise polishing technology Product List

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Ultra-precision grinding technology that can achieve Rmax ≤ 0.05s.

Cannot be detected by roughness gauges! Using polishing agents and grinders known as mirror finish!

Our company has skilled artisans capable of achieving ultra-precision polishing on the roll surface after plating, with a maximum height of surface roughness Rmax = 0.05s or less. Even minute polishing marks that are not detected by roughness gauges are eliminated through the craftsmanship of our artisans. This ultra-precision polishing technology, which ensures such accuracy, often receives products that have been polished by other companies for re-polishing. After mechanical polishing, we use a (oil-based) polishing compound and grinder known as mirror finishing to achieve a surface roughness with a maximum height of Rmax = 0.05s or less. [Features] ■ Skilled artisans capable of achieving ultra-precision polishing ■ Minute polishing marks that are not detected by roughness gauges are eliminated through artisan techniques *For more details, please refer to the related link page or feel free to contact us.

  • Processing Contract

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Ultra-precision grinding technology

Flatter, smoother, thinner, more beautiful. Leading the world with ultra-precision polishing technology.

Our company provides unparalleled precision and quality using unique processing technologies for each material. Since our establishment in 1961, we have repeatedly engaged in independent research and development based on years of experience in polishing processing, achieving high-level technical capabilities in handling various single crystal materials. We support research and development with our five super polishing technologies (super smoothing, super flattening, super thinning, super distortion-free, and super cleaning). 【Features】 ■ Surface roughness at the nanometer (nm) level ■ Flatness and thickness variation at the micrometer (μm) level ■ Thickness and film thickness from a few μm to several tens of μm ■ Elimination of surface distortion layers ■ Removal of atomic-level metal contamination ■ Removal of submicron-level particles *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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